Purge Station:

Ø   Process Yield

Consistent, reliable, uniform interface layers for growth or deposition; Ensures process control.

Ø  Defect control

No moisture or AMCs to catalyze defects such as voltage threshold shifts, corrosion, voids, T-

topping etc.

Ø  Cycle time

Process windows extended-no reworks; potentially less process steps (end-to-end processing).

Ø  Tool Throughput

Elimination of process steps and recipes e.g. high temp bakes, oxide breakthrough, or pre-cleans;

shorter vacuum pump-down times.

Ø  WIP Management

Longer storage capabilities.