300mm Wafer Processing Carriers (FOUP using in Fab)
A300 Wafer Carrier
The A300 G3 FOUP offers advanced wafer isolation technology in a cost-effective design for 300 mm wafer processing.
The A300 features:
- Precision wafer planes
- Purge options
- Easy to clean and maintain
- Long term reliability
- Superior protection from contaminants
- Fully SEMI compliant
- Serialization and traceability
- Non-metallic door
- Multiple ESD paths to ground
