300mm Wafer Processing Carriers (FOUP using in Fab)

Spectra™ Wafer Carrier

Overview

The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and low cost of ownership for your facility.

Features

• Industry-proven door for equipment interoperability and long life
• Wafer supports integral with shell give excellent wafer plane performance and reliable wafer access
• Accurate equipment interfaces
• – Top robotic flange
• – Bottom kinematic coupling
• Ergonomic side handles for manual handling
• Unsurpassed cleanability and dryability
• Effective ESD path-to-ground
• ESD shell option provides added protection for wafers
• Purge capable
• High-strength assembly
• Wafers retained against shock and vibration
• Meets all applicable SEMI standards

Materials of Construction

• Ultrapure polycarbonate used in the FOUP shell, door housing and door panels 
• STAT-PRO® 3000 carbon-filled PEEK™ material used in wafer contact areas in the shell and wafer retainer
• STAT-PRO® 500 carbon-filled polycarbonate used in the ESD FOUP shell, door housing, door components
• Ultrapure thermoplastic elastomer (TPE) material used in the critical door seal