Secure 300 mm wafer shipment in an automated full pitch (FOSB using Fab to Fab)

Highest Productivity For Your Facility

The SB300 is engineered to improve the overall productivity of your facility by offering maximum wafer protection, optimum automation interface and increased overall yield.

• Precise wafer planes maximize your wafer transfer throughput
• Dimensionally stable design maximizes tool and AMHS uptime, allowing less unscheduled downtime
• FIMS automation minimizes contribution to contamination
• Simple cleaning of entire assembly encourages increased reuse

Clean and Secure Wafer Transport

The SB300 is engineered and manufactured to provide maximum protection of your wafers during transport:

• Ultrapure polycarbonate housing is dimensionally stable, with low particle generation
  and outgassing
• Molded-in wafer planes ensure wafer location accuracy and limit particulation
• FIMS automation reduces wafer exposure to ambient environments
• Specially engineered door cushion system limits cross slotting, is low in outgassing and minimizes wafer rotation
• Automated FIMS compatibility minimizes potential contamination from human interaction
• Protective gasket and filter limits infiltration of external particles
• Ergonomically designed and positioned handles ensure proper operator handling
• Metal-free assembly prevents metallic contamination

Materials Description

Ultrapure polycarbonate material is used in the manufacture of the door and shell assembly, offering:

• Low inorganics
• Low particle generation
• Low outgassing
• Dimensional stability
• SPI recycle code – 7

TPE materials are used in the manufacture of the door strip and gasket, offering:

• Excellent sturdiness and resilience
• Resistance to creep and flex fatigue
• Low outgassing
• Low levels of metals
• SPI recycle code – 7
• The SB300 ergonomic handles are made from black nylon.
• The robotic lifting flange is made from carbonfiber-filled polycarbonate.