200mm Process Wafer Carriers

Traditional molded PFA process wafer carriers and modular construction PFA process enhancement wafer carriers for wet chemical processing applications.

Process Enhancement Wafer Carriers

General Specifications

• Open flow carrier allows solutions to pass through evenly and quickly
• One-half the volume and mass of traditional process carriers
• One-fourth the surface area of traditional process carriers
• Modular construction includes reinforcement rods for added rigidity and strength
• Lift points on carrier ends for automated handling
• V-notch locators on carrier ends and rails forlocation on equipment
• Chemical resistant PFA material wetted surfaces
• Wafer capacity: 50
• Pocket spacing: 6.4mm (0.25")

Traditional Process Wafer Carriers

General Specifications

• Open side walls allow solutions to pass through evenly and quickly
• Low and high profile
• "H" bar for equipment interface
• Locating track notches at the center of the thirteenth pocket
• Pins and holes on the top rail (unless noted)
• Chemical resistant PFA material
• Wafer capacity: 25, 26 or 50
• D1 dimension: 25.4mm (1.00")
• Pocket spacing: A192-82M: 3.2mm (0.13")
  All others: 6.4mm (0.25")
• Pocket flat: 1.7mm (0.07")

Material Specifications

Natural PFA

• High purity process wafer carrier material
• Translucent perfluoroalkoxy (PFA)
• Temperature limits:
  Continuous use (process enhancement): 165°C
  Continuous use (traditional): 180°C
  Wafer insertion: 250°C