12吋Fab廠內晶圓承載晶舟盒(FOUP)

The F300 AutoPod™ wafer carrier is a 25-capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and the highest overall output for your facility.

Highest Overall Output for Your Facility

The F300 is engineered to improve the overall productivity of your facility by offering wafer protection and optimum automation interface. Yield and throughput increases are achieved by:

• Maximizing your wafer transfer throughput by precise wafer plane performance
• Maximizing tool and automated materials handling systems uptime and long-term reliability with a dimensionally stable integral cassette
• Door mechanism reliability exceeding 100,000 cycles
• Maximizing water cleaning capability and minimizing dry time for reduced downtime
• Minimizing any contribution to contamination optimum automation

Clean and Secure Wafer Protection

The F300 is engineered and manufactured to provide maximum protection for your wafers from contamination, electrostatic discharge and UV exposure:

• Ultrapure, UV filtering (to 500 nm) polycarbonate housing material
• Static dissipative STAT-PRO^® 3000 carbon fiber filled PEEK™ in areas requiring a path to ground
• Integral, single piece cassette provides reliable wafer plane performance
• Robust wafer retainer ensures repeatable water positioning and minimizes particle generation
• Metal-free assembly prevents metallic contamination

Material Description

STAT-PRO® 3000

Entegris’ STAT-PRO® 3000 material is an advanced, static dissipative blend of polyetheretherketone (PEEK™ polymer) and carbon fiber. Used in the wafer supports and robotic lifting flange, this material offers:

• Static protection
• Low particle generation
• Abrasion resistance
• Dimensional stability
• Temperature limit: Wafer insertion: 300°C