12吋廠對廠運輸晶舟盒(FOSB)

Highest Productivity For Your Facility

The SB300 is engineered to improve the overall productivity of your facility by offering maximum wafer protection, optimum automation interface and increased overall yield.

• Precise wafer planes maximize your wafer transfer throughput
• Dimensionally stable design maximizes tool and AMHS uptime, allowing less unscheduled downtime
• FIMS automation minimizes contribution to contamination
• Simple cleaning of entire assembly encourages increased reuse

Clean and Secure Wafer Transport

The SB300 is engineered and manufactured to provide maximum protection of your wafers during transport:

• Ultrapure polycarbonate housing is dimensionally stable, with low particle generation
  and outgassing
• Molded-in wafer planes ensure wafer location accuracy and limit particulation
• FIMS automation reduces wafer exposure to ambient environments
• Specially engineered door cushion system limits cross slotting, is low in outgassing and minimizes wafer rotation
• Automated FIMS compatibility minimizes potential contamination from human interaction
• Protective gasket and filter limits infiltration of external particles
• Ergonomically designed and positioned handles ensure proper operator handling
• Metal-free assembly prevents metallic contamination

Materials Description

Ultrapure polycarbonate material is used in the manufacture of the door and shell assembly, offering:

• Low inorganics
• Low particle generation
• Low outgassing
• Dimensional stability
• SPI recycle code – 7

TPE materials are used in the manufacture of the door strip and gasket, offering:

• Excellent sturdiness and resilience
• Resistance to creep and flex fatigue
• Low outgassing
• Low levels of metals
• SPI recycle code – 7
• The SB300 ergonomic handles are made from black nylon.
• The robotic lifting flange is made from carbonfiber-filled polycarbonate.