Spectra Wafer Carrier
12吋Fab廠內晶圓承載晶舟盒(FOUP)
Spectra™ Wafer Carrier
Overview
The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and low cost of ownership for your facility.
Features
Materials of Construction
Spectra™ Wafer Carrier
Overview
The Spectra™ FOUP is a 25+1 capacity front opening unified pod (FOUP) that provides clean and secure wafer transport, optimum automation integration and low cost of ownership for your facility.
Features
- Industry-proven door for equipment interoperability and long life
- Wafer supports integral with shell give excellent wafer plane performance and reliable wafer access
- Accurate equipment interfaces
- – Top robotic flange
- – Bottom kinematic coupling
- Ergonomic side handles for manual handling
- Unsurpassed cleanability and dryability
- Effective ESD path-to-ground
- ESD shell option provides added protection for wafers
- Purge capable
- High-strength assembly
- Wafers retained against shock and vibration
- Meets all applicable SEMI standards
Materials of Construction
- Ultrapure polycarbonate used in the FOUP shell, door housing and door panels
- STAT-PRO® 3000 carbon-filled PEEK™ material used in wafer contact areas in the shell and wafer retainer
- STAT-PRO® 500 carbon-filled polycarbonate used in the ESD FOUP shell, door housing, door components
- Ultrapure thermoplastic elastomer (TPE) material used in the critical door seal