12吋廠對廠運輸晶舟盒(FOSB)

Highest Productivity For Your Facility

The SB300 is engineered to improve the overall productivity of your facility by offering maximum wafer protection, optimum automation interface and increased overall yield.
  • Precise wafer planes maximize your wafer transfer throughput
  • Dimensionally stable design maximizes tool and AMHS uptime, allowing less unscheduled downtime
  • FIMS automation minimizes contribution to contamination
  • Simple cleaning of entire assembly encourages increased reuse
 

Clean and Secure Wafer Transport

The SB300 is engineered and manufactured to provide maximum protection of your wafers during transport:
  • Ultrapure polycarbonate housing is dimensionally stable, with low particle generation
    and outgassing
  • Molded-in wafer planes ensure wafer location accuracy and limit particulation
  • FIMS automation reduces wafer exposure to ambient environments
  • Specially engineered door cushion system limits cross slotting, is low in outgassing and minimizes wafer rotation
  • Automated FIMS compatibility minimizes potential contamination from human interaction
  • Protective gasket and filter limits infiltration of external particles
  • Ergonomically designed and positioned handles ensure proper operator handling
  • Metal-free assembly prevents metallic contamination

Materials Description

Ultrapure polycarbonate material is used in the manufacture of the door and shell assembly, offering:
  • Low inorganics
  • Low particle generation
  • Low outgassing
  • Dimensional stability
  • SPI recycle code – 7
TPE materials are used in the manufacture of the door strip and gasket, offering:
  • Excellent sturdiness and resilience
  • Resistance to creep and flex fatigue
  • Low outgassing
  • Low levels of metals
  • SPI recycle code – 7
  • The SB300 ergonomic handles are made from black nylon.
  • The robotic lifting flange is made from carbonfiber-filled polycarbonate.
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