Traditional molded PFA process wafer carriers and modular construction PFA process enhancement wafer carriers for wet chemical processing applications.
Process Enhancement Wafer Carriers General Specifications
Open flow carrier allows solutions to pass through evenly and quickly
One-half the volume and mass of traditional process carriers
One-fourth the surface area of traditional process carriers
Modular construction includes reinforcement rods for added rigidity and strength
Lift points on carrier ends for automated handling
V-notch locators on carrier ends and rails forlocation on equipment
Chemical resistant PFA material wetted surfaces
Wafer capacity: 50
Pocket spacing: 6.4mm (0.25")
Traditional Process Wafer Carriers General Specifications
Open side walls allow solutions to pass through evenly and quickly
Low and high profile
"H" bar for equipment interface
Locating track notches at the center of the thirteenth pocket
Pins and holes on the top rail (unless noted)
Chemical resistant PFA material
Wafer capacity: 25, 26 or 50
D1 dimension: 25.4mm (1.00")
Pocket spacing: A192-82M: 3.2mm (0.13") All others: 6.4mm (0.25")
Pocket flat: 1.7mm (0.07")
Material Specifications Natural PFA
High purity process wafer carrier material
Translucent perfluoroalkoxy (PFA)
Temperature limits: Continuous use (process enhancement): 165°C Continuous use (traditional): 180°C Wafer insertion: 250°C