Sensor On wafer - BNSR
Dry Etching process uses plasma to remove material and shape wafer features. Temperature fluctuations at the electrostatic chuck (ESC) can significantly impact etch rates and uniformity, leading to defects.
BNSR’s Sensor On Wafer is embedded thermal sensors inside thick wafer which could auto load to process chamber to record wafer surface temperature and transit data via wireless. Friendly UI could let customer read and use data easily.