FOUP for 200mm Wafer Application
Converting most popular FOUP – Entegris A300 to 8” wafer application for easy adaption in 12” & 8” mixed production tools. Standard A300 FOUP interface to reduce the interoperability issue. Replacing the 12” side supports to 8” side supports. - Proven A300 platform to create zero interface issue. Door/KC Plate/Purge
- Proven A300 performance to eliminate process concerns.
Configuration All components are the original Entegris made A300 components except the side supports. Side supports are made by ESD PC for 8” wafer application. Specification | Shell | A300 Clear PC or EBM |
| Bottom Plate | A300 ESD PC |
| OHT Handle | A300 ESD PC |
| Side Handle | A300 ESD PC |
| Side Supports | ESD PC |
| Capacity | 25 pcs 8” wafers |
Notes : wafer retainer in door side might need to replace by HWS’s foams as different production requirement.